Power module and heat sink system
US11974387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jan 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.