Systems and methods for heat dissipation in computing systems with environment resistance
US11974413B2 · kind B2 · utility
0Cited by
15References
17Claims
0Family size
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Key dates
| Filing date | Apr 27, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Apr 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.