Soft motherboard-rigid plugin module architecture
US11974502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Nov 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10219
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Soft motherboards having rigid plugin modules are described herein. In one aspect of the present disclosure, an electronic device can include a polymeric substrate having: a plurality of slots, each configured for receiving an electronic module; one or more electrical junctions including a stretchable conductive interconnect electronically coupling a slot to another slot of the plurality of slots; and at least one electronic module including: a film configured to: support other components of the electronic module; and be inserted, and be partially housed in, one of the plurality of slots of the polymeric substrate; and at least one electrode coupled to the film and positioned to be in contact with a corresponding electrical junction of the polymeric substrate when the film is partially housed in the polymeric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.