Thermoelectric conversion body, thermoelectric conversion module, and method for manufacturing thermoelectric conversion body
US11974504B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2020 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/852
Abstract
Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.