Thin film electrode assembly
US11975188B2 · kind B2 · utility
1Cited by
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20Claims
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Assignee
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Key dates
| Filing date | Jan 21, 2021 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | May 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B7/04
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An apparatus includes an elongate thin film body extending from a first end to a second end. A plurality of electrodes is disposed on the thin film body. A plurality of electrode connection traces each coupled to a respective one of the electrodes. A plurality of attachment structures is placed at predetermined locations about the thin film body. An outer molding surrounds the thin film body. The attachment structures provide connection points for the outer molding, thus allowing for adhesion between the outer molding and the thin film body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.