Composition applicator tip and instrumentation
US11975352B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2019 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Jul 16, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/325
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition applicator tip adapted to deliver a “rippled” bead of composition to a surface of a substrate, the composition applicator tip including: a hollow conduit structure defining a pair of opposed openings and adapted to deliver the composition there through, wherein a first opening of the pair of opposed openings is adapted to be coupled to a composition delivery vessel; and an end wall enclosing a second opening of the pair of opposed openings, wherein the end wall defines an elongate slot that is adapted to be disposed substantially parallel to the surface of the substrate in use and expel the composition there through, and wherein a portion of the end wall disposed beneath the elongate slot has a height such that the composition falls by gravity a predetermined distance to the surface of the substrate in use as the composition applicator tip is translated along the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.