Multiphenylethynyl-containing and lightly crosslinked polyimides capable of memorizing shapes and augmenting thermomechanical stability
US11975477B2 · kind B2 · utility
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Key dates
| Filing date | Jul 21, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Sep 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/12
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.