Systems, methods, and apparatus for passive cooling of UAVs
US11975846B2 · kind B2 · utility
0Cited by
16References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 16, 2020 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Dec 16, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0021
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.