Patent · US Active

Hermetically sealed transparent cavity and package for same

US11975962B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

Schott AG · DE

Inventors

Jens Ulrich Thomas · Mainz, DE
Thomas Zetterer · Bad Kreuznach, DE
Yutaka Onezawa · Otsu, JP
Antti Määttänen
Kurt Nattermann · Ockenheim, DE
Robert Hettler · Kumhausen, DE

Key dates

Filing date	Jan 24, 2022
Grant date	May 7, 2024
Priority date	—
Expiry date	Mar 18, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0118
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.