Method for manufacturing a microelectromechanical structure and microelectromechanical structure

US11975964B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jochen Reinmuth · Reutlingen, DE
• Ralf Boessendoerfer · Dinkelsbühl, DE

Key dates

• Filing date: Aug 27, 2021
• Grant date: May 7, 2024
• Expiry date: Nov 22, 2042

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0133
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for manufacturing a microelectromechanical structure. The method includes: forming a first and a second functional layer including recesses, a third functional layer, and three insulating layers situated therebetween, a structured lateral area of the third functional layer defining a movable structure, the insulating layers and the first and second functional layers each including a lateral area situated beneath the structured lateral area of the third functional layer and corresponding to a perpendicular projection of the structured lateral area; etching the insulating layers to remove the lateral area of the third insulating layer, and expose the movable structure, all recesses of the first functional layer situated in the lateral area of the first functional layer being formed by narrow trenches, the first functional layer being formed to include an electrically insulated segment in the lateral area which is separated from the remainder of the first functional layer by trenches.