Polishing composition and method for producing same
US11976220B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jul 21, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Jul 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.