Floor panel
US11976471B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Jul 21, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.