Hierarchical network for stacked memory system
US11977766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Jul 30, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/0679
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A hierarchical network enables access for a stacked memory system including or more memory dies that each include multiple memory tiles. The processor die includes multiple processing tiles that are stacked with the one or more memory die. The memory tiles that are vertically aligned with a processing tile are directly coupled to the processing tile and comprise the local memory block for the processing tile. The hierarchical network provides access paths for each processing tile to access the processing tile's local memory block, the local memory block coupled to a different processing tile within the same processing die, memory tiles in a different die stack, and memory tiles in a different device. The ratio of memory bandwidth (byte) to floating-point operation (B:F) may improve 50× for accessing the local memory block compared with conventional memory. Additionally, the energy consumed to transfer each bit may be reduced by 10×.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.