Dual-substrate antenna package structure and method for manufacturing the same
US11978694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2021 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Dec 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a dual-substrate antenna package structure and a method for manufacturing the same. The package structure includes a main substrate and at least one antenna substrate. The antenna substrate is provided on a pad of the main substrate by an array of solder balls placed on the antenna substrate, at least one chip is electrically connected to the main substrate, and metal wiring provided on the main substrate electrically connects the pad to the chip. The array of solder balls includes support solder balls and conventional solder balls, and the support solder balls have a melting point high than 250° C. A spacing distance between the antenna substrate and the main substrate can be kept stable during the reflow soldering process and subsequent processes because the support solder balls having the high melting point can always maintain the stability of the structure during the reflow soldering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.