Chip or system-in-package protection using the GMI effect
US11978708B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jun 17, 2021 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Dec 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Device of the chip or electronic system-in-package type, comprising at least one element for protecting at least part of at least one face of the device, said protective element comprising at least:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.