Structure and formation method of chip package with protective lid
US11978715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2021 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Sep 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure. The first adhesive element has a first thermal conductivity. The method also includes forming a second adhesive element directly on the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The method further includes attaching a protective lid to the chip structure through the first adhesive element and the second adhesive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.