Liquid cooling high-density pluggable modules for a network element
US11980009B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Oct 5, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4268
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.