Display substrate including configuration of insulation layers covering contact pads in bonding region, and manufacturing method thereof
US11980074B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 30, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Sep 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1216
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A display substrate and a manufacturing method thereof, and a display device are disclosed. The display substrate includes a base substrate, a plurality of sub-pixels, at least one group of contact pads, and a first insulation layer. The base substrate includes a display region and a bonding region located at one side of the display region. At least one group of contact pads includes a plurality of contact pads, at least one of the plurality of contact pads includes a first contact pad metal layer and a second contact pad metal layer, the second contact pad metal layer covers an edge of the first contact pad metal layer. The first insulation layer is located in gaps between the plurality of contact pads and covers edges of the plurality of contact pads, and is configured to expose surfaces of the plurality of contact pads facing away from the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.