Method for machining a workpiece in the production of an optical element

US11980990B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Manfred Matena · Essen, DE
• Franz-Josef Stickel · Aalen, DE
• Marc Saitner · Oberkochen, DE
• Robert Fichtl · Aalen, DE
• Hans-Peter Brust · Lauterburg, DE

Key dates

• Filing date: Mar 5, 2020
• Grant date: May 14, 2024
• Expiry date: Feb 7, 2043

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24D2203/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for the zonal polishing of a workpiece includes using a polishing tool to guide a structured polishing pad over the surface of workpiece to remove material from the workpiece. A structured polishing pad includes a structuring adapted to the movement of a polishing tool.