Polyamide molding compounds for hypochlorite-resistant applications
US11981813B2 · kind B2 · utility
1Cited by
41References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2020 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous; hypochlorous acid-containing solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.