High-temperature fast-curing starch-based adhesive for particleboards and preparation method thereof
US11981834B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2023 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Dec 6, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure discloses a high-temperature fast-curing starch-based adhesive for particleboards and a preparation method thereof, belonging to the technical field of adhesive preparation. The low viscosity of the starch-based adhesive is ensured by selecting a crosslinking monomer which does not self-crosslink in a reaction process in the present disclosure, and a binary crosslinking agent matched with the crosslinking monomer is added before use to be quickly crosslinked with the crosslinking monomer at high temperature so as to ensure better thermosetting property and water resistance as well as faster curing speed of the starch-based adhesive at the same time, which meets the requirements of the particleboards for the adhesive, solves the problem of long curing time of the existing starch-based adhesives at high temperatures, further shortens the curing time of the starch-based adhesives to about 60 s, and improves the production efficiency of the particleboards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.