Mechanical force redistribution sensor array embedded in a single support layer
US11983352B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Jun 18, 2015 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Jun 18, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04102
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An MFR sensor array having a first supporting layer. The array has a second supporting layer. The array has a force sensing component disposed between the first and second supporting layers. The array has protrusions combined with the force supporting component, where there are only two supporting layers. When a force is applied to the second supporting layer, the force causes the second supporting layer to contact protrusions so the force is transmitted through the protrusions to the force supporting component and through the force supporting component. An MFR sensor array. A system for sensing. A method for sensing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.