Ceramic circuit board, heat-dissipating member, and aluminum-diamond composite
US11983586B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2021 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Mar 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09936
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.