Lead frame structure and manufacturing method thereof
US11984385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2021 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Jun 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.