Method for manufacturing side wire for substrate and substrate structure
US11984546B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Feb 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a side wire for a substrate and a substrate structure are provided. The method includes: forming a plurality of first pattern structures on a side surface of the substrate, wherein a gap between any adjacent two of the plurality of first pattern structures connects a top surface and a bottom surface of the substrate to each other; forming a conductive material film covering the side surface of the substrate; and removing the plurality of first pattern structures and a portion of the conductive material film that is attached on the plurality of first pattern structures, and maintaining a portion of the conductive material film that is located between any adjacent two of the plurality of first pattern structures as the side wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.