Method of cleaning, support, and cleaning apparatus
US11986869B2 · kind B2 · utility
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1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jun 6, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2209/032
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of cleaning includes placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.