Molding device for casting an optical article with wafer on top, corresponding method and optical article
US11987016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2019 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jun 6, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D11/0073
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding device for casting an optical article with a thermoset resin the optical article defining two opposed main surfaces, one of which being formed by an optical functional wafer, the molding device comprising: —a. a molding element (2) forming a rear or a front part of a casting mold —b. a gasket (3) intended to surround the molding element —c. an initially curved wafer (4) defining a predetermined curvature depending on one of the two main surfaces of the optical article to be molded —d. a closing element (6) defining in a closing position in which the peripheral part of the wafer on the gasket is pinched, a pouring space between the molding element, the gasket and the wafer —e. spacing means (9) interposed between the wafer and the molding element to define an internal volume between the wafer and the closing element, the spacing means, wafer and closing element being configured to form a set hermetic to the resin to be poured into the molding device the closing member occupies a closing position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.