System and method of dielectric bonding
US11987033B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Aug 26, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB62D29/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method for dielectric bonding including a dielectric heater having a pair of opposing electrode plates, a nest removably coupled to a first electrode plate of the pair of electrode plates, and an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates. The nest having a plurality of cooling channels defined in a body thereof in which a cooling fluid circulates to cool a material assembly that is supported by the nest. The interchangeable electrode assembly having a plurality of concentrator members that are configured to concentrate energy from a voltage source in predetermined locations on the material assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.