Component mounting system and tape scraps collecting device
US11987408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2023 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jun 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0417
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.