Damascene interconnect structure, actuator device, and method of manufacturing damascene interconnect structure
US11987493B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2019 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Mar 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion, an end portion of the metal layer, and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface. The end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.