Process for hydrophobizing shaped insulation-material bodies based on silica at ambient pressure
US11987528B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jul 8, 2019 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jul 8, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/52
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a process for producing a hydrophobized shaped thermal-insulation body, comprising pressing or compacting a thermal-insulation mixture containing a silica, an IR opacifier, an organosilicon compound A and an organosilicon compound B, wherein
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.