Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
US11987731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2019 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | May 16, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.