Heat sink and housing assembly
US11988468B2 · kind B2 · utility
0Cited by
28References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2019 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Nov 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface of the first heat dissipation plate is connected to a bottom of the heat sink body. The second heat dissipation plate is mounted on a second surface of the first heat dissipation plate opposite to the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.