Thermal interface material detection through an electrical conductivity test
US11988621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2021 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Mar 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/36
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.