Apparatus and method for determining strength of a substrate and peal strength of a joint between the substrate and structure with load applying elements
US11988646B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jul 21, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a apparatus for determining at least one a bending strength of a substrate and peel strength of a joint between a structure and the substrate. The apparatus includes a fixture configured to support the structure and a plurality of support beams positioned on either sides of the fixture and configured to support the substrate. Further, the apparatus includes a plurality of load applying members, which are configured to apply load onto the substrate to deform the substrate relative to the plurality of support beams. Furthermore, the apparatus includes a sensor, which is configured to determine parameters such as axial load induced in the structure, peel stress in the joint between the substrate and the structure and bending moments on the substrate during application of load onto the substrate, to determine at least one of the bending strength and the peel strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.