Device for transferring heat between a first module and a second module
US11988882B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Nov 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to a device for transferring heat between a second module, for example an optical transceiver module, and a first module, for example a heat sink. The device comprises a holder for holding the second module, a first unit configured to be thermally coupled to the first module, and a second unit which is urged against the second module placed in the holder by a biasing apparatus. The first and second units are thermally coupled to one another through a plurality of protrusions of the first or second unit and a plurality of complementary cavities of the other of the first and second unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.