Hermetic electrical feedthrough comprising a Pt—Ni-based pin alloy
US11990252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2021 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C38/58
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.