Integrated circuit on flexible substrate manufacturing process
US11990484B2 · kind B2 · utility
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20References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 27, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jul 27, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.