Light-emitting device and method for manufacturing the same
US11990577B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2021 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.