Stack for fabricating an integrated circuit intended to perform an electromagnetic-lens function for a reconfigurable transmitarray antenna
US11990678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Jun 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A stack for fabricating an integrated circuit intended to perform an electromagnetic-lens function for a reconfigurable transmitarray antenna, the stack including in succession: a substrate that includes a set of first active components configured to generate a phase shift, and that has first and second opposite surfaces, the first active components being integrated monolithically into the substrate; a metal layer, forming a ground plane on the first surface of the substrate; a layer of a cured polymer, formed on the metal layer; vias that are electrically insulated from the metal layer and that are arranged to electrically connect pairs of planar antennas, each electrically connected pair of planar antennas including first and second planar antennas that are aligned along the normal to the first and second surfaces of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.