Component mounting device and manufacturing method for mounting substrate
US11991831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2020 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Aug 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.