Embedded circuit board and manufacturing method thereof
US11991838B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 31, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.