Mold set for a ski press
US11992747B2 · kind B2 · utility
0Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2020 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/3652
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Mold set for insertion in a ski press (2) comprising a substructure which has a base plate (4), a lower contour (5) and a lower heating element (7), and an upper structure having a cover plate (16), an upper contour (15), and an upper heating element, so that a ski mold can be inserted between the substructure and the upper structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.