Laser cutting metal foil with a polymer backing layer
US11992895B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2020 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | May 27, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B15/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser cutting a metal foil by providing a polymer film as a carrier layer for the metal foil where the metal foil is ablated by the laser beam wavelength selected for laser cutting and wherein the polymer film is a polymer film that is transparent to the laser beam wavelength selected for laser cutting such that laser cutting produces metal foil cut parts in a substrate while the polymer backing remains intact for supporting the cut parts for subsequent separation of the cut parts from substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.