Lead-free and halogen-free solder paste
US11992901B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2023 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Sep 27, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present application relates to the technical field of welding materials, and particularly to a lead-free and halogen-free solder paste, including a solder alloy powder and a welding flux with a mass ratio of 85-90:10-15, the solder alloy powder is Sn-2.5Be-0.8Ag-0.5Cu alloy powder, and the welding flux includes the following components: itaconic acid, succinic acid, a surfactant, a thixotropic agent, modified rosin, a composite solvent, a corrosion inhibitor, and an acrylic type activator. Its preparation method includes the following steps: mixing the modified rosin, the composite solvent and the corrosion inhibitor, heating under stirring, cooling, adding itaconic acid, succinic acid and the acrylic type activator under stirring, cooling, adding the thixotropic agent for emulsification dispersion, adding the surfactant under stirring, grinding to obtain a welding flux after cooling, and stirring the solder alloy powder and the welding flux under vacuum to obtain the solder paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.