Patent · US Active

Method for contour punching an output stack and punching device

US11992966B2 · kind B2 · utility

0Cited by
1References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 11, 2022
Grant dateMay 28, 2024
Priority date
Expiry dateMar 11, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB26F2210/02
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for contour punching an output stack consisting of sheet-like material and a punching device for carrying out the method Includes providing at least two punching procedures. A large proportion of an unprinted region is separated from a printed region in a first punching procedure and a first punching waste produced thereby is collected separately, whereby the quantity of the second punching waste which is formed in a second punching procedure is significantly less than if only a single punching procedure were to be carried out. By collecting the first punching waste and the second punching waste separately, it is possible to provide this waste in each case for appropriate disposal or appropriate recycling.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.