Heat-sensitive recording material
US11993095B2 · kind B2 · utility
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3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2019 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | May 12, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M2205/38
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a heat-sensitive recording material comprising an undercoat layer and a heat-sensitive recording layer formed in this order on a support, the undercoat layer containing hollow plastic particles and a binder, the heat-sensitive recording layer containing a leuco dye and a developer, and the heat-sensitive recording material having an elastic modulus of 200 N/mm2 or less as measured by a nanoindentation method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.