Patent · US Active

Hermetically sealed, toughened glass package and method for producing same

US11993511B2 · kind B2 · utility

0Cited by

5References

21Claims

0Family size

Assignee

Schott AG · DE

Inventors

Jens Ulrich Thomas · Mainz, DE
Thomas Zetterer · Bad Kreuznach, DE
Antti Määttänen
Robert Hettler · Kumhausen, DE
Yutaka Onezawa · Otsu, JP

Key dates

Filing date	Jan 14, 2022
Grant date	May 28, 2024
Priority date	—
Expiry date	Mar 30, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0163
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.