Insulating medium rubber film and production method thereof and multi-layer printed-circuit board
US11993704B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Mar 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0298
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An insulating medium rubber film and a production method thereof, and a multi-layer printed-circuit board. The insulating medium rubber film includes a release film and an insulating medium layer arranged on the surface of the release film, where materials of the insulating medium layer include saturated polyester resin, amino resin or blocked isocyanate, epoxy resin, a curing agent, inorganic filler and a curing accelerator. According to the insulating medium rubber film and the production method thereof and the multi-layer printed-circuit board, by introducing the saturated polyester resin component into an epoxy resin composition, the produced insulating medium rubber film has the advantages that a dielectric constant is low, a dielectric dissipation factor is low, thermal expansion is not liable to happen, and adhesion is good.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.