Adhesive composition for semiconductor circuit connection and adhesive film containing the same
US11993731B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 5, 2020 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Aug 28, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2203/326
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.